January 20, 2019 - 4:22pm#1
Apple I work in progress
Hi everyone. I have a question about the power transient heatsink. I installed it using a thermoconductive paste that I placed between the sink and the PCB. Today I was advised to remove the thermoconductive paste from where I put it and to buy mica instead. Precisely this product: https://www.ebay.it/sch/i.html?_odkw=lm323&_osacat=0&_from=R40&_trksid=m570.l1313&_nkw=mica+to-3&_sacat=0 I have also been advised to interpose the thermo-conductive paste between the heat sink and the mica itself, in addition to using also those rubber protections for the screws. I used a multimeter to check that the LM323A transistor pins are not shorted and are not. I like the idea of protecting the screws so that they do not make contact and I thought to put the thermoconductive paste under the mica exactly as I was advised. But I would like to keep the thermoconductive paste even between the sink and the PCB. The motivation of the board to remove the thermoconductive paste between the PCB and the sink is the fact that according to those who advised me it is not correct to ensure that both the PCB to dissipate the heat itself, but only the sink. What do you think?