I have been getting conflicting reports on how to do this, even my A+ Book doesn't give me exact directions on how to do it
What is the *BEST* way to apply this. I just bought a new Heatsink (all copper) and some Arctic Silver Ceramic-based Thermal Spread.
I want to know how to get the best out of this stuff. Every time I build a system for a client, either the component manufacturer tells you to apply a hell of a lot of the stuff (which doesn't seem as logical when you think of how it is just supposed to bridge the gap, not insulate it from the heat sink) or don't tell you anything.
I need to know this, as my System has been always running a bit hot, so I got a new heatsink am getting rid of that aluminum block on it) and got some spread to go with it off of newegg.com (both products)
Anyways, do i have to worry about sanding the pad on the heat sink? What is the best way to take off the old compound?
once I get this knowledge, it will help me build better systems. A site with visual pictures would help.
Remember, this system right now is running at 50 Deg C. when under full load. WAY TOO HOT for a Sempron. I have tried redoing it but don't think I am getting it right.
Also, the new fan/heatsink combo has more CFPM Air Movement than the last one (37cfpm vs. 22Cfpm.) and want to get the BEST cooling out of this.
Also, if you have seen my new case, it has already dropped the CPU Temp of the system down 4 Deg C already